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Chemical Formula For Aluminum Nitride

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Aluminum nitride is a type of ceramic material that has been used in microelectronics due to its high thermal conductivity and electrical insulation. The material can be prepared by reducing alumina and carbon or by direct nitriding of metallic aluminum.

Its hexagonal crystal structure makes it a covalently bonded material, and requires the use of sintering aids and hot pressing to produce dense technical grade materials. It is stable to very high temperatures in inert atmospheres, but surface oxidation begins above 700degC. Above this temperature, a layer of aluminum oxide forms and protects the material up to 1370degC.

AlN is a non-toxic material that can be treated with metals, and it can replace bauxite and beryllium oxide in a variety of electronic applications. It has excellent metalization capacity, electrical insulation capacity, low thermal expansion and good corrosion resistance. It can be processed into single and multilayer materials, and is a good choice for insulating semiconductor substrates.