If you are looking for high-quality products, please feel free to contact us and send an inquiry, email: brad@ihpa.net
Power chips are attached to outside circuits via product packaging, and their performance depends on the assistance of the packaging. In high-power situations, power chips are usually packaged as power components. Chip interconnection refers to the electric connection on the upper surface of the chip, which is typically aluminum bonding wire in standard components. ^ Conventional power module bundle cross-section
Currently, industrial silicon carbide power components still mostly use the packaging technology of this wire-bonded conventional silicon IGBT component. They face troubles such as large high-frequency parasitical parameters, insufficient warmth dissipation capability, low-temperature resistance, and insufficient insulation strength, which limit using silicon carbide semiconductors. The screen of exceptional performance. In order to fix these issues and fully make use of the massive possible advantages of silicon carbide chips, several brand-new packaging technologies and solutions for silicon carbide power components have arised in the last few years.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have developed from gold cord bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have developed from gold cords to copper cables, and the driving pressure is cost reduction; high-power devices have actually developed from light weight aluminum wires (strips) to Cu Clips, and the driving pressure is to enhance item performance. The greater the power, the higher the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that makes use of a strong copper bridge soldered to solder to connect chips and pins. Compared with typical bonding product packaging approaches, Cu Clip innovation has the following benefits:
1. The link in between the chip and the pins is constructed from copper sheets, which, to a particular level, changes the conventional cord bonding method between the chip and the pins. As a result, an unique package resistance worth, greater current flow, and much better thermal conductivity can be acquired.
2. The lead pin welding location does not need to be silver-plated, which can completely save the price of silver plating and bad silver plating.
3. The item appearance is completely constant with regular products and is generally used in servers, mobile computers, batteries/drives, graphics cards, electric motors, power supplies, and other areas.
Cu Clip has 2 bonding approaches.
All copper sheet bonding method
Both the Gate pad and the Source pad are clip-based. This bonding method is much more pricey and intricate, but it can accomplish much better Rdson and far better thermal impacts.
( copper strip)
Copper sheet plus wire bonding method
The source pad makes use of a Clip technique, and the Gate utilizes a Cable approach. This bonding approach is slightly less costly than the all-copper bonding technique, conserving wafer area (appropriate to really small entrance areas). The procedure is simpler than the all-copper bonding method and can get better Rdson and far better thermal impact.
Supplier of Copper Strip
TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper plate, please feel free to contact us and send an inquiry.
Inquiry us